Microfabrication

• 6 inch wafers (silicon or glass)
• Photolithography (350 nm)
• Thin films deposition (Si3N4, SiO2, Polysilicon, Al, Ti, TiN, HSQ, SU-8)
• Etch – wet or RIE (Si3N4, SiO2, Polysilicon, Al, Ti, TiN, HSQ, SU-8)
• Ion Implantation (B, As, P, BF2)
• Wet cleaning
• Oxidation and diffusion
• Metrology

Wafer-level probing

• Fully automated and semi-automated wafer probers
• NI PXI and Keithley S530 testers
• 6, 8 and 12 inch wafers
• Highly qualified and experienced team
• Different wafermap formats available
• Full production traceability
• Parameter extraction

Wafer Backgrinding

• 150mm (6'') and 200mm (8") wafers
• TTV in a wafer: 3µm
• TTV among wafers: 5µm
• Finished surface roughness: down to 10 Å RMS

Wafer dicing

• Blade dicing – up to 200mm (8") silicon or glass wafers
• Laser stealth dicing – up to 300 mm (12") silicon wafers

Automatic Optical Inspection

• Up to 300mm (12") wafers, sawn or patterned
• 1µm resolution for defect detection and classification

IC micromodule encapsulation

• Smart chip solution (for credit card, dual, SIM card and alike)
• Up to 300mm (12") inked or mapped wafers

Wafer level die sorting

• Up to 300mm (12") wafers
• Wafer-to-wafer reconstruction to custom diameter or shape
• 'Known good die' option from wafer map
• CSP (chip-scale packaging) to reel
• Pick-and-place to waffle pack
• Flip chip option

Focused Ion Beam (FIB)

• IC editing
• High resolution imaging
• Cross sections
• Construction analysis
• IEE using XeF2
• Mo GIS